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Glass Bubbles Microspheres with 4-125MPa Compressive Strength and 0.04 W/m·K Thermal Conductivity for Weight Reduction in Construction

Bulk Density: 0.12-0.15

Chemical Composition: SiO2, Na2O, CaO, MgO, Al2O3

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Conductive Coated Hollow Glass Microspheres for Aerospace Adhesives

Place of Origin SHANXI CHINA

Brand Name HAINUO

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Hollow Glass Beads with 0.15-0.18 Bulk Density and 10-250 Microns Diameter Range for High Compressive Strength Applications

Material: Glass

Applications: Paints, Coatings, Plastics, Adhesives, Sealants

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Glass Bubbles Microspheres with 0.04 W/m·K Thermal Conductivity and 10-65 µm Diameter for High Chemical Resistance Applications

Diameter: 10-65 µm

Size: Microscopic

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High Transparency Micro Glass Bubbles Hollow Glass Beads Heat Transfer Material

Compressive Strength: 2000 Psi

Color: Transparent

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Glass Bubbles Microspheres with 750 Psi Compressive Strength, High Chemical Resistance, and Lightweight Properties for Industrial Applications

Compressivestrength: Up To 100 MPa

Compressive Strength: 750 Psi

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750 Psi Compressive Strength Glass Bubbles Microspheres with 0.12-0.15 Bulk Density and High Chemical Resistance for Composite Materials

Compressive Strength: 750 Psi

Chemical Resistance: High

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High Thermal Stability Hollow Glass Microspheres Improve Heat Transfer Performance

Density: 0.15-1.0 G/cm³

Applications: Insulation, Filtration, Etc.

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Glass Bubbles Microspheres with 10-65 µm Diameter, Up To 100 MPa Compressive Strength, and -60°C To 650°C Temperature Resistance

Size: Microscopic

Truedensity: 2.4 G/cm³

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HN25HS Hollow Glass Microspheres for Aerospace Adhesives 25-85µm

Product Name: HN25HS Glass Microspheres

Application: Construction,Rubber, Aerospace Adhesives,Boyancy Materials.

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HN38HS Hollow Glass Microspheres 6000 psi for Thermal Insulation

Product Name: HN38HS Glass Microspheres

Application: Thermal Insulation Materials,Battery Pack Glue,Structual Sealants.

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HN25HS Hollow Glass Microspheres for Buoyancy Materials 25-85µm

Product Name: HN25HS Glass Microspheres

Application: Construction,Rubber, Aerospace Adhesives,Boyancy Materials.

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HN25HS Hollow Glass Microspheres for Thermal Insulation 25-85µm

Product Name: HN25HS Glass Microspheres

Application: Construction,Rubber, Aerospace Adhesives,Boyancy Materials.

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HN46HS Hollow Glass Microspheres for Battery Pack Glue 10-65 µm

Product Name: HN46HS Glass Microspheres

Application: Automobile Vehicle

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HN20HS Hollow Glass Microspheres for Battery Pack Glue 25-90 µm

Product Name: HN20HS Glass Microspheres

Application: Automobile Vehicle

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HN60S Hollow Glass Microspheres 10-60 µm for Structural Sealants

Product Name: HN60S Glass Microspheres

Application: Rubber,Ocean, Automobile Vehicle.

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Low Thermal Conductivity 0.04-0.06 W/m·K Non-flammable Hollow Glass Bubbles with High Compressive Strength 70 MPa for Composite and Insulation Uses

HN20 Hollow Glass Microspheres for Aerospace 30-105µm 500psi

Low Thermal Conductivity Hollow Glass Bubbles Borosilicate Microspheres Solutions

Hollow Glass Bubbles with Compressive Strength Up To 100 MPa, Low Thermal Conductivity 0.108 W/m·K, and Lightweight 0.15 - 0.30 g/cm³

Glass Bubbles Microspheres with 4-125MPa Compressive Strength and 0.04 W/m·K Thermal Conductivity for Weight Reduction in Construction

Conductive Coated Hollow Glass Microspheres for Aerospace Adhesives

Hollow Glass Beads with 0.15-0.18 Bulk Density and 10-250 Microns Diameter Range for High Compressive Strength Applications

Glass Bubbles Microspheres with 0.04 W/m·K Thermal Conductivity and 10-65 µm Diameter for High Chemical Resistance Applications

High Transparency Micro Glass Bubbles Hollow Glass Beads Heat Transfer Material

Glass Bubbles Microspheres with 750 Psi Compressive Strength, High Chemical Resistance, and Lightweight Properties for Industrial Applications

750 Psi Compressive Strength Glass Bubbles Microspheres with 0.12-0.15 Bulk Density and High Chemical Resistance for Composite Materials

High Thermal Stability Hollow Glass Microspheres Improve Heat Transfer Performance

Glass Bubbles Microspheres with 10-65 µm Diameter, Up To 100 MPa Compressive Strength, and -60°C To 650°C Temperature Resistance

HN25HS Hollow Glass Microspheres for Aerospace Adhesives 25-85µm

HN38HS Hollow Glass Microspheres 6000 psi for Thermal Insulation

HN25HS Hollow Glass Microspheres for Buoyancy Materials 25-85µm

HN25HS Hollow Glass Microspheres for Thermal Insulation 25-85µm

HN46HS Hollow Glass Microspheres for Battery Pack Glue 10-65 µm

HN20HS Hollow Glass Microspheres for Battery Pack Glue 25-90 µm

HN60S Hollow Glass Microspheres 10-60 µm for Structural Sealants