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HN25HS Hollow Glass Microspheres for Buoyancy Materials 25-85µm

Product Name: HN25HS Glass Microspheres

Application: Construction,Rubber, Aerospace Adhesives,Boyancy Materials.

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HN25HS Hollow Glass Microspheres for Thermal Insulation 25-85µm

Product Name: HN25HS Glass Microspheres

Application: Construction,Rubber, Aerospace Adhesives,Boyancy Materials.

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HN46HS Hollow Glass Microspheres for Battery Pack Glue 10-65 µm

Product Name: HN46HS Glass Microspheres

Application: Automobile Vehicle

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HN20HS Hollow Glass Microspheres for Battery Pack Glue 25-90 µm

Product Name: HN20HS Glass Microspheres

Application: Automobile Vehicle

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HN60S Hollow Glass Microspheres 10-60 µm for Structural Sealants

Product Name: HN60S Glass Microspheres

Application: Rubber,Ocean, Automobile Vehicle.

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HN46HS Hollow Glass Microspheres for Oil Well Cementing 10000 psi

Product Name: HN46HS Glass Microspheres

Application: 5G Technology,Automobile,Oil Well Cementing.

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Glass Microbubbles with Excellent Resistance To Acids And Alkalis, Low Thermal Conductivity 0.04 - 0.06 W/m·K, and High Temperature Resistance Up To 600°C

Optical Properties: Highly Reflective

Chemicalresistance: Excellent Resistance To Acids And Alkalis

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High Surface Area Glass Microbubbles with Temperature Resistance Up To 600°C and Compressive Strength 16000 Psi

Temperatureresistance: Up To 600°C

Thermal Condictivity: 0.153

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Compressive Strength Transparent Glass Microspheres with Low Density and Viscosity

Material: Glass

Density: Low

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HN15HS Glass Microspheres for Aviation and Aerospace Applications

Product Name: HN15HS Glass Microspheres

Application: Aviation Materials, Aerospace Accessories,Thermal Insolution.

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HN40 Hollow Glass Microspheres for Thermal Insulation

Place of Origin SHANXI CHINA

Brand Name HAINUO

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Low Thermal Conductivity 0.04-0.06 W/m·K Non-flammable Hollow Glass Bubbles with High Compressive Strength 70 MPa for Composite and Insulation Uses

HN20 Hollow Glass Microspheres for Aerospace 30-105µm 500psi

Low Thermal Conductivity Hollow Glass Bubbles Borosilicate Microspheres Solutions

Hollow Glass Bubbles with Dielectric Constant 1.2-2.2 and Low Thermal Conductivity for High-Strength Composite Materials

HN25HS Hollow Glass Microspheres for Buoyancy Materials 25-85µm

HN25HS Hollow Glass Microspheres for Thermal Insulation 25-85µm

HN46HS Hollow Glass Microspheres for Battery Pack Glue 10-65 µm

HN20HS Hollow Glass Microspheres for Battery Pack Glue 25-90 µm

HN60S Hollow Glass Microspheres 10-60 µm for Structural Sealants

HN46HS Hollow Glass Microspheres for Oil Well Cementing 10000 psi

Glass Microbubbles with Excellent Resistance To Acids And Alkalis, Low Thermal Conductivity 0.04 - 0.06 W/m·K, and High Temperature Resistance Up To 600°C

High Surface Area Glass Microbubbles with Temperature Resistance Up To 600°C and Compressive Strength 16000 Psi

Compressive Strength Transparent Glass Microspheres with Low Density and Viscosity

HN15HS Glass Microspheres for Aviation and Aerospace Applications

HN40 Hollow Glass Microspheres for Thermal Insulation