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Hollow Glass Microspheres

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HN32HS Hollow Glass Microspheres 25-75µm for Aerospace Adhesives

Product Name: HN32HS Glass Microspheres

Application: Construction,Rubber,Ocean

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HN25HS Hollow Glass Microspheres for Aerospace Adhesives 25-85µm

Product Name: HN25HS Glass Microspheres

Application: Construction,Rubber, Aerospace Adhesives,Boyancy Materials.

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HN25HS Hollow Glass Microspheres for Aerospace Adhesives 25-85µm

Product Name: HN25HS Glass Microspheres

Application: Construction,Rubber, Aerospace Adhesives,Boyancy Materials.

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HN15HS Glass Microspheres for Aviation and Aerospace Applications

Product Name: HN15HS Glass Microspheres

Application: Aviation Materials, Aerospace Accessories,Thermal Insolution.

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Conductive Coated Hollow Glass Microspheres for Aerospace Adhesives

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Hollow Glass Microspheres with conductive coatings

Borosilicate microspheres with conductive coatings

Aerospace Adhesives Borosilicate microspheres

Place of Origin SHANXI CHINA

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HN38 Hollow Glass Microspheres for Aerospace Adhesives 20-75µm

Product Name: HN38 Glass Microspheres

Application: Aviation Materials

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25-85uM Hollow Microspheres Glass Microbubbles For Enhanced Protection

Dielectric Constant: 1.2-2.2（100MHZ）

Porosity: High

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High Density Aviation Foam Glass Microballoons High Thermal Conductivity 0.085

Diameter: 25-85µm

Thermal Condictivity: 0.085

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High Porosity Hollow Glass Microspheres Particle Surface Area High

Thermal Condictivity: 0.085

True Density: 0.244-0.256

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Heat Transfer Powder Hollow Microspheres Glass Microspheres OEM ODM

Porosity: High

Application: Construction,Rubber, Aerospace Adhesives,Boyancy Materials.

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High Particle Surface Area Hollow Microspheres Bubbles Thermal Conductivity 0.085

Dielectric Constant: 1.2-2.2（100MHZ）

Diameter: 25-85µm

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HN25HS High Density Hollow Microspheres Buoyancy For Aviation

Thermal Condictivity: 0.085

Application: Construction,Rubber, Aerospace Adhesives,Boyancy Materials.

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Thermal Conductivity 0.085 W/MK Glass Hollow Microspheres Enhance Shield

Surface Area: High

Density: 0.15-1.0 G/cm³

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0.15-1.0G/Cm3 Hollow Microspheres For The Aviation Industry

True Density: 0.244-0.256

Dielectric Constant: 1.2-2.2（100MHZ）

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HAINUO High Density Hollow Microspheres Boyancy Materials

Porosity: High

Density: 0.15-1.0 G/cm³

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Thermal Conductivity 0.085 Hollow Microspheres Reduce Mechanical Stress Improve Flameproof

Particle Surface Area: High

Density: 0.15-1.0 G/cm³

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