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Good price 25-85uM Hollow Microspheres Glass Microbubbles For Enhanced Protection online Video

25-85uM Hollow Microspheres Glass Microbubbles For Enhanced Protection

Dielectric Constant: 1.2-2.2(100MHZ)

Porosity: High

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Good price High Tensile Strength Hollow Glass Bubbles Microspheres In Aerospace Adhesives online Video

High Tensile Strength Hollow Glass Bubbles Microspheres In Aerospace Adhesives

Product Name: HN38 Glass Microspheres

Application: Aviation Materials

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Good price Aerospace Adhesives Hollow Glass Microspheres With Conductive Coatings online Video

Aerospace Adhesives Hollow Glass Microspheres With Conductive Coatings

Place of Origin SHANXI CHINA

Brand Name HAINUO

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500 Psi Aviation Materials HN15HS Glass Microspheres In Composite Circuit Boards

Product Name: HN15HS Glass Microspheres

Application: Aviation Materials, Aerospace Accessories,Thermal Insolution.

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Aerospace Accessories 750 psi Hollow Glass Bubble HN25HS Thermal Insolution Aerospace Adhesives

Product Name: HN25HS Glass Microspheres

Application: Construction,Rubber, Aerospace Adhesives,Boyancy Materials.

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HN25HS Glass Microspheres Epoxy Injection Molding Buoyancy Materials

Product Name: HN25HS Glass Microspheres

Application: Construction,Rubber, Aerospace Adhesives,Boyancy Materials.

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Aerospace Adhesives 2000 Psi Glass Micro Spheres Of Aviation Field

Product Name: HN32HS Glass Microspheres

Application: Construction,Rubber,Ocean

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High Density Aviation Foam Glass Microballoons High Thermal Conductivity 0.085

Diameter: 25-85µm

Thermal Condictivity: 0.085

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High Porosity Hollow Glass Microspheres Particle Surface Area High

Thermal Condictivity: 0.085

True Density: 0.244-0.256

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Heat Transfer Powder Hollow Microspheres Glass Microspheres OEM ODM

Porosity: High

Application: Construction,Rubber, Aerospace Adhesives,Boyancy Materials.

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High Particle Surface Area Hollow Microspheres Bubbles Thermal Conductivity 0.085

Dielectric Constant: 1.2-2.2(100MHZ)

Diameter: 25-85µm

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HN25HS High Density Hollow Microspheres Buoyancy For Aviation

Thermal Condictivity: 0.085

Application: Construction,Rubber, Aerospace Adhesives,Boyancy Materials.

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Thermal Conductivity 0.085 W/MK Glass Hollow Microspheres Enhance Shield

Surface Area: High

Density: 0.15-1.0 G/cm³

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0.15-1.0G/Cm3 Hollow Microspheres For The Aviation Industry

True Density: 0.244-0.256

Dielectric Constant: 1.2-2.2(100MHZ)

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HAINUO High Density Hollow Microspheres Boyancy Materials

Porosity: High

Density: 0.15-1.0 G/cm³

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Thermal Conductivity 0.085 Hollow Microspheres Reduce Mechanical Stress Improve Flameproof

Particle Surface Area: High

Density: 0.15-1.0 G/cm³

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