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16000 Psi Hollow Glass Bubble HN18K In Drilling Operations

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HN18K Hollow Glass Microspheres 16000 Psi for Oil Well Cementing

Product Name: HN18K Glass Microspheres

Application: Oil Well Cementing,Hollow Glass Bubble,HN18K,Composite Circuit Board,Low Density Drilling Fluid

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HN16K Hollow Glass Microspheres for Oil Well Cementing 10-55µm

Product Name: HN16K Glass Microspheres

Application: Oil Well Cementing ,Hollow Glass Bubble,HN16K,Composite Circuit Board,Chassis Coating

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HN60HS Hollow Glass Microspheres 14000 Psi for Drilling Fluid

Product Name: HN60HS Glass Microspheres

Application: 5G,Low Density Drilling Fluid,Oil Well Cementing.

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HN60 Hollow Glass Microspheres 10000 Psi for Oil Field Drilling

Product Name: HN60 Glass Microspheres

Application: Oil Field

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HN40 Hollow Glass Microspheres 10-75 µm for Oil Well Cementing

Product Name: HN40 Glass Microspheres

Application: Construction

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Hollow Glass Microspheres with Dielectric Constant 1.2-2.2, Softening Temperature 855C, and Size Range 10 to 250 Microns for Lightweight Fillers

Surface Area: High

Bulkdensity: 0.15 - 0.30 G/cm³

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High Surface Area Hollow Glass Microspheres with Softening Temperature 855℃ and Excellent Chemical Resistance

Temperatureresistance: Up To 600°C

Softening Tempera: 855℃

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Hollow Glass Microspheres with Temperature Resistance Up To 600°C, Compressive Strength 4-125MPa, and Dielectric Constant 1.2-2.2

Particular Size: 2-120μm

Mpressive Strength: 4-125MPa/500-18000 Psi

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Hollow Glass Microspheres with Softening Temperature 855℃ and Dielectric Constant 1.2-2.2 for Oil Exploration Area

Diameter: 10-55µm

Technique: Chopped

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Chopped Hollow Glass Microspheres with Bulk Density 0.15 to 0.30 G/cm3, Size Range 10 to 250 Microns, and Compressive Strength Up To 350 MPa for Thermal Insulation

Bulk Density: 0.10 -0.40g/cm3

Sizerange: 10 - 250 Microns

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HN38 Hollow Glass Microspheres with 4-125 MPa Compressive Strength 1.2-2.2 Dielectric Constant and 855℃ Softening Temperature

Temperatureresistance: Up To 600°C

Softening Tempera: 855℃

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Microscopic Hollow Glass Microspheres with Bulk Density 0.10 to 0.40g/cm3 and Compressive Strength Up To 350 MPa for Industrial Applications

Mpressive Strength: 4-125MPa/500-18000 Psi

Sizing: Silane And Cation Of Water

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Hollow Glass Microspheres with Excellent Chemical Resistance High Surface Area and Up To 600°C Temperature Resistance

Bulkdensity: 0.15 - 0.30 G/cm³

Chemicalresistance: Excellent

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Dielectric Constant 1.2-2.2 Hollow Glass Microspheres with High Surface Area for Lightweight Fillers in Composite Materials

Technique: Chopped

Dielectric Constant: 1.2-2.2（100MHZ）

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2-120μm Hollow Glass Microspheres with 855℃ Softening Temperature and Excellent Chemical Resistance for Oil Exploration

Dielectric Constant: 1.2-2.2（100MHZ）

Particular Size: 2-120μm

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1050℃ Melting Temperature Borosilicate Glass Hollow Glass Microspheres with 10-250 Microns Size Range for High-Temperature Applications

Sizerange: 10 - 250 Microns

Melting Temperature: 1050℃

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