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hollow glass bubble aerospace adhesives (59) Sport online manufacturer

HN25HS Hollow Glass Microspheres for Aerospace Adhesives 25-85µm

Product Name: HN25HS Glass Microspheres

Application: Construction,Rubber, Aerospace Adhesives,Boyancy Materials.

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HN15 Hollow Glass Microspheres for Aerospace Adhesives 30-105 µm

Product Name: HN15 Glass Microspheres

Application: Aviation Material

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HN32HS Hollow Glass Bubbles 25-75µm for Aerospace Adhesives

Product Name: HN32HS Glass Microspheres

Application: Construction,Rubber,Ocean

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High Chemical Resistance Low Thermal Conductivity Non-flammable Hollow Glass Bubbles for Insulation Applications

Chemicalresistance: High

Material: Glass

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High Chemical Resistance Non-flammable Hollow Glass Bubbles with Low Thermal Conductivity for Lightweight Composites

Flammability: Non-flammable

Dielectric Constant: 1.2-2.2（100MHZ）

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Low Thermal Conductivity Non-flammable Hollow Glass Bubbles with Spherical Shape for Industrial Solutions

Flammability: Non-flammable

Thermalconductivity: 0.04 - 0.06 W/m·K

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Hollow Glass Bubbles with Low Thermal Conductivity for Lightweight Fillers and Non-flammable Applications

Applications: Lightweight Fillers, Insulation, Composites, Paints, Coatings

Chemicalresistance: High

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Non-flammable Hollow Glass Bubbles with 0.15 - 0.30 G/cm³ Bulk Density Ensure Dimensional Stability in Manufacturing

Flammability: Non-flammable

Density: 0.12 - 0.60 G/cm³

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Hollow Glass Bubbles with Compressive Strength Up To 70 MPa and Low Thermal Conductivity for Non-flammable Applications

Shape: Spherical

Color: White Or Off-white

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HN32 Hollow Glass Microspheres for Aerospace Adhesives 25-80 µm

Product Name: HN32 Glass Microspheres

Application: Aviation Materials

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Hollow Glass Bubbles with Low Thermal Conductivity for Dimensional Stability and Non-flammable Safety

Compressivestrength: Up To 70 MPa

Density: 0.12 - 0.60 G/cm³

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Non-flammable Hollow Glass Bubbles with Diameter 30-105 Micrometers and Thermal Conductivity 0.04-0.06 W/m·K for Lightweight Composites

Material: Glass

Applications: Lightweight Fillers, Insulation, Composites, Paints, Coatings

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Low Thermal Conductivity 0.04-0.06 W/m·K Non-flammable Hollow Glass Bubbles with High Compressive Strength 70 MPa for Composite and Insulation Uses

Thermalconductivity: 0.04 - 0.06 W/m·K

Flammability: Non-flammable

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HN20 Hollow Glass Microspheres for Aerospace 30-105µm 500psi

Product Name: HN20 Glass Microspheres

Application: Aviation Material

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Low Thermal Conductivity Hollow Glass Bubbles Borosilicate Microspheres Solutions

Thermal Expansion: Low

Cost: Reasonable

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Hollow Glass Bubbles with Dielectric Constant 1.2-2.2 and Low Thermal Conductivity for High-Strength Composite Materials

Shape: Spherical

Density: 0.12 - 0.60 G/cm³

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