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HN60HS Hollow Glass Microspheres for Composite Circuit Boards

Product Name: HN60HS Glass Microspheres

Application: Composie Circuit Board,Oil Well Cementing,Low Density Drilling Fluid.

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HN60HS Hollow Glass Microspheres for 5G PCBs 10-55µm 14000 psi

Product Name: HN60HS Glass Microspheres

Application: 5G Technology

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HN46HS Glass Microspheres for 5G and Oil Well Cementing

Product Name: HN46HS Glass Microspheres

Application: 5G Technology,Automobile,Oil Well Cementing.

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High Compressive Strength 10000 Psi Glass Micro Spheres Bubbles For Filtration

Material: Glass

Compressive Strength: 10000 Psi

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High Thermal Stability Hollow Glass Microspheres Improve Heat Transfer Performance

Density: 0.15-1.0 G/cm³

Applications: Insulation, Filtration, Etc.

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Filtration Micro Glass Bubbles 10-65µM For Improved Heat Transfer

Product Name: Micro Glass Bubbles

Applications: Insulation, Filtration, Etc.

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10-65µM Diameter Micro Glass Bubbles High Chemical Resistance Particles

Bulk Density: 0.24-0.27

Chemical Resistance: High

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