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Hollow Glass Microspheres

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Glass Bubbles Microspheres

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Glass Microbubbles

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Hollow Glass Bubbles

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Hollow Glass Beads

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Micro Glass Bubbles

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Hollow Microspheres

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Glass Microballoons

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16000 Psi Hollow Glass Bubble HN18K In Drilling Operations

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Low Density Drilling Fluid HN60HS Hollow Microspheres 14000 Psi

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Low Density Drilling Fluid Glass Bubbles Microspheres BuoyanCy Material

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Low Density Drilling Fluid Hollow Glass Microspheres 14000 Psi

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Hollow Glass Bubbles For Reservoir Engineering

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Anti-Cracking Hollow Glass Bubbles HN32HS Exterior Wall Coating Additive 100 MPa Compressive Strength

Compressive Strength: Up To 100 MPa

True Density: 0.44 - 0.48 G/cm3

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Thermal Insulation Hollow Glass Bubbles HN32HS Architectural Coating Filler Low Conductivity 0.108 W/mK

Thermal Conductivity: 0.108 W/mK

Compressive Strength: Up To 100 MPa

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Ultra-Low Density HN15 Hollow Glass Bubbles 0.08-0.15 g/cm³ Thermal Insulation Filler for Energy Efficient Coatings

Material: Borosilicate Glass

Model: HN15

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HN40 Hollow Glass Bubbles 80 MPa Compressive Strength Lightweight Filler for Injection Molding Thermoplastic Composites

Material: Borosilicate Glass

Model: HN40

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Durable Hollow Glass Microspheres with 0.15 g/cm³ True Density, 600 psi Compressive Strength, and 40 μm Particle Size for Aerospace and Submersible Equipment

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1 to 2 Microns Wall Thickness Hollow Glass Bubbles with True Density 0.44 to 0.48 and High Chemical Resistance for Industrial Use

Material: Glass

Chemicalresistance: High

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High Chemical Resistance Hollow Glass Bubbles with Up To 100 MPa Compressive Strength and Low Thermal Conductivity

Chemical Composition: SiO2, Na2O, CaO, MgO, Al2O3

Cost: Reasonable

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SiO2 Hollow Glass Bubbles with Low Thermal Expansion High Chemical Resistance and Low Thermal Conductivity for Industrial Applications

Thermal Expansion: Low

Thermal Condictivity: 0.108

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Hollow Glass Bubbles with 0.15 - 0.30 G/cm³ Bulk Density for Lightweight Composites Featuring Low Thermal Conductivity and Chemical Resistance

Cost: Reasonable

Refractive Index: Approximately 1.1

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Hollow Glass Bubbles with 0.15 - 0.30 G/cm³ Bulk Density and 1 - 2 Microns Wall Thickness for High Compressive Strength Up To 100 MPa

Application: Rubber,Ocean, Automobile Vehicle.

Bulk Density: 0.15 - 0.60 G/cm³

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Hollow Glass Bubbles with Compressive Strength Up To 100 MPa, Low Thermal Conductivity 0.108 W/m·K, and Lightweight 0.15 - 0.30 g/cm³

Application: Rubber,Ocean, Automobile Vehicle.

Moisture Content: < 0.5%

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Low Thermal Conductivity 0.108 Hollow Glass Bubbles with High Chemical Resistance and Lightweight 0.15-0.30 G/cm³ for Composites and Insulation

Refractive Index: Approximately 1.1

Thermal Expansion: Low

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Hollow Glass Bubbles with Bulk Density 0.15 to 0.60 G/cm³, Moisture Content < 0.5%, and High Chemical Resistance

Chemical Composition: SiO2, Na2O, CaO, MgO, Al2O3

Moisture Content: < 0.5%

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Hollow Glass Bubbles and Glass Microspheres with Moisture Content Below 0.5%, Low Thermal Expansion, and High Compressive Strength Up To 100 MPa

Compressive Strength: Up To 100 MPa

Material: Glass

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Low Thermal Conductivity Hollow Glass Bubbles with High Chemical Resistance for Lightweight Fillers

Chemicalresistance: High

Bulk Density: 0.15 - 0.60 G/cm³

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High Strength Glass Bubbles Microspheres with 100 MPa Compressive Strength and Low Thermal Conductivity 0.04 W/m·K for Enhanced Material Performance

Thermal Conductivity: Low

Thermalconductivity: 0.04 W/m·K

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