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1 to 2 Microns Wall Thickness Hollow Glass Bubbles with True Density 0.44 to 0.48 and High Chemical Resistance for Industrial Use

Material: Glass

Chemicalresistance: High

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High Chemical Resistance Hollow Glass Bubbles with Up To 100 MPa Compressive Strength and Low Thermal Conductivity

Chemical Composition: SiO2, Na2O, CaO, MgO, Al2O3

Cost: Reasonable

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SiO2 Hollow Glass Bubbles with Low Thermal Expansion High Chemical Resistance and Low Thermal Conductivity for Industrial Applications

Thermal Expansion: Low

Thermal Condictivity: 0.108

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Hollow Glass Bubbles with 0.15 - 0.30 G/cm³ Bulk Density for Lightweight Composites Featuring Low Thermal Conductivity and Chemical Resistance

Cost: Reasonable

Refractive Index: Approximately 1.1

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Hollow Glass Bubbles with 0.15 - 0.30 G/cm³ Bulk Density and 1 - 2 Microns Wall Thickness for High Compressive Strength Up To 100 MPa

Application: Rubber,Ocean, Automobile Vehicle.

Bulk Density: 0.15 - 0.60 G/cm³

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Hollow Glass Bubbles with Compressive Strength Up To 100 MPa, Low Thermal Conductivity 0.108 W/m·K, and Lightweight 0.15 - 0.30 g/cm³

Application: Rubber,Ocean, Automobile Vehicle.

Moisture Content: < 0.5%

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Low Thermal Conductivity 0.108 Hollow Glass Bubbles with High Chemical Resistance and Lightweight 0.15-0.30 G/cm³ for Composites and Insulation

Refractive Index: Approximately 1.1

Thermal Expansion: Low

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Hollow Glass Bubbles with Bulk Density 0.15 to 0.60 G/cm³, Moisture Content < 0.5%, and High Chemical Resistance

Chemical Composition: SiO2, Na2O, CaO, MgO, Al2O3

Moisture Content: < 0.5%

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Hollow Glass Bubbles and Glass Microspheres with Moisture Content Below 0.5%, Low Thermal Expansion, and High Compressive Strength Up To 100 MPa

Compressive Strength: Up To 100 MPa

Material: Glass

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Low Thermal Conductivity Hollow Glass Bubbles with High Chemical Resistance for Lightweight Fillers

Chemicalresistance: High

Bulk Density: 0.15 - 0.60 G/cm³

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High Chemical Resistance Non-flammable Hollow Glass Bubbles with Low Thermal Conductivity for Lightweight Composites

Flammability: Non-flammable

Dielectric Constant: 1.2-2.2（100MHZ）

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Hollow Glass Bubbles with Low Thermal Conductivity for Lightweight Fillers and Non-flammable Applications

Applications: Lightweight Fillers, Insulation, Composites, Paints, Coatings

Chemicalresistance: High

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High Chemical Resistance Low Thermal Conductivity Non-flammable Hollow Glass Bubbles for Insulation Applications

Chemicalresistance: High

Material: Glass

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Low Thermal Conductivity Non-flammable Hollow Glass Bubbles with Spherical Shape for Industrial Solutions

Flammability: Non-flammable

Thermalconductivity: 0.04 - 0.06 W/m·K

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Hollow Glass Bubbles with Dielectric Constant 1.2-2.2 and Low Thermal Conductivity for High-Strength Composite Materials

Shape: Spherical

Density: 0.12 - 0.60 G/cm³

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Non-flammable Hollow Glass Bubbles with 0.15 - 0.30 G/cm³ Bulk Density Ensure Dimensional Stability in Manufacturing

Flammability: Non-flammable

Density: 0.12 - 0.60 G/cm³

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