Place of Origin:
SHANXI CHINA
Brand Name:
HAINUO
Model Number:
HN25HS
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High Density Hollow Microspheres for Dielectric Constant 1.2-2.2 & Bulk Density 0.12-0.15
Hollow Microspheres are a type of lightweight material with various applications, such as construction, rubber, aerospace adhesives and boyancy materials. It has a true density of 0.244-0.256 and a thermal conductivity of 0.085. The dielectric constant in 100MHz ranges from 1.2 to 2.2. It has a high surface area, which is beneficial to prevent deformation, efficient heat transfer, improve flameproof and shock absorption.
Technical Parameter | Value |
---|---|
Diameter | 25-85µm |
Bulk Density | 0.12-0.15 |
True Density | 0.244-0.256 |
Density | 0.15-1.0 G/cm³ |
Application | Construction, Rubber, Aerospace Adhesives, Boyancy Materials. |
Porosity | High |
Particle Surface Area | High |
Surface Area | High |
Dielectric Constant | 1.2-2.2(100MHZ) |
Thermal Condictivity | 0.085 |
Keywords | Improve Corrosion Resistance, Protection Systems, Reduce Cost. |
Hainuo HN25HS Hollow Microspheres are an innovative, lightweight aggregate that can provide a range of benefits for a variety of industrial, commercial and residential applications. The hollow spherical shape of HN25HS Hollow Microspheres reduces mechanical stress, improves flameproof performance and reduces sound wave transmission. Additionally, the high particle surface area and low bulk density of HN25HS Hollow Microspheres helps to reduce the weight of a product while maintaining its strength and performance. Its true density is between 0.244 to 0.256 g/cm³ and its bulk density is between 0.12 to 0.15 g/cm³. Hainuo HN25HS Hollow Microspheres offers excellent thermal conductivity with a value of 0.085 W/m·K.
Hainuo HN25HS Hollow Microspheres can be used in a broad range of applications, including:
Hainuo HN25HS Hollow Microspheres can be used in any application where lightweight, high-performance material is required. They are an ideal choice for any application that requires flameproof performance, sound wave reduction, or reduction of mechanical stress. The high particle surface area and low bulk density of HN25HS Hollow Microspheres makes them an excellent choice for applications where a lightweight, high-performance material is needed.
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