high thermal stability hollow glass microspheres (161) Sport online manufacturer
Product Name: HN16K Glass Microspheres
Application: Oil Well Cementing ,Hollow Glass Bubble,HN16K,Composite Circuit Board,Chassis Coating
Product Name: HN32 Glass Microspheres
Application: Aviation Materials
Product Name: HN32 Glass Microspheres
Application: Aviation Materials
Product Name: HN60 Glass Microspheres
Application: Oil Field
Product Name: HN60 Glass Microspheres
Application: Rubber
Product Name: HN18K Glass Microspheres
Application: Oil Well Cementing,Hollow Glass Bubble,HN18K,Composite Circuit Board,Low Density Drilling Fluid
Dielectric Constant: 1.2-2.2(100MHZ)
Particular Size: 2-120μm
Temperatureresistance: Up To 600°C
Softening Tempera: 855℃
Surface Area: High
Bulkdensity: 0.15 - 0.30 G/cm³
Sizerange: 10 - 250 Microns
Melting Temperature: 1050℃
Bulkdensity: 0.15 - 0.30 G/cm³
Chemicalresistance: Excellent
Product Name: HN60HS Glass Microspheres
Application: 5G,Low Density Drilling Fluid,Oil Well Cementing.
Thermal Expansion: Low
Thermal Conductivity: Low
Flammability: Non-flammable
Cost: Reasonable
True Density: 0.194-0.206
Application: Oil Field
Temperatureresistance: -200°C To 600°C
Application Areas: Building Materials
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