$Good price High Refractive Index Glass Microbubbles with Low Thermal Conductivity 0.2 W/m·K and Dielectric Constant 1.2-2.2 (100MHz) for Optical Applications online$

High Refractive Index Glass Microbubbles with Low Thermal Conductivity 0.2 W/m·K and Dielectric Constant 1.2-2.2 (100MHz) for Optical Applications

Manufacturing Process: Synthesized From Silica Precursors

Thermal Condictivity: 0.2

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Hollow Glass Bubbles with 0.15 - 0.30 G/cm³ Bulk Density for Lightweight Composites Featuring Low Thermal Conductivity and Chemical Resistance

Cost: Reasonable

Refractive Index: Approximately 1.1

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Glass Microballoons and Hollow Glass Spheres with 20-75 µm Diameter, Chemical Resistance, and 0.05 W/m·K Thermal Conductivity

Compressive Strength: Up To 100 MPa

True Density: 0.58-0.62

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HN40 Hollow Glass Microspheres for Thermal Insulation

Place of Origin SHANXI CHINA

Brand Name HAINUO

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Glass Microballoons Hollow Glass Spheres with Good Resistance To Most Chemicals, Thermal Conductivity 0.2, and 1-2 Microns Wall Thickness

Average Diameter: 10-100 Microns

Diameter: 20-75 µm

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High Temperature Resistance Glass Microbubbles with 16000 Psi Compressive Strength and Low Thermal Conductivity for Rubber Applications

Temperatureresistance: Up To 600°C

Appearance: White To Off-white Spherical Particles

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Glass Microbubbles with 10-100 Microns Diameter and 0.2 Thermal Conductivity for Automobile Vehicle Manufacturing

Surface Area: High

Application: Rubber,Ocean, Automobile Vehicle.

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16000 Psi Compressive Strength Glass Microbubbles with Superior Bonding Strength and Thermal Stability for Battery Pack Glue

Appearance: White To Off-white Spherical Particles

Surface Area: High

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High Durability Weight Reduction Glass Bubbles Microspheres with Particular Size 2-120μm

Chemical Resistance: High

Name: Glass Bubbles Microspheres

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HN20 Hollow Glass Microspheres for Thermal Insulation 30-105µm

HN32 Hollow Glass Microspheres for Aviation 25-80 µm

HN60 Hollow Glass Microspheres for Injection Molding 10-65 µm

HN38 Hollow Glass Microspheres for Aviation Materials 20-75µm

Hollow Glass Bubbles with 0.15 - 0.30 G/cm³ Bulk Density and 1 - 2 Microns Wall Thickness for High Compressive Strength Up To 100 MPa

Glass Microballoons and Hollow Glass Spheres for Lightweight Durable Solutions with Thermal Conductivity 0.05 W/m·K and Chemical Resistance

Hollow Glass Bubbles with Low Thermal Conductivity for Dimensional Stability and Non-flammable Safety

Hollow Glass Beads with Dielectric Constant 1.2 to 2.2, Thermal Conductivity 0.04 W/m·K, and Compressive Strength 100 to 8000 Psi for Industrial Applications

Hollow Glass Bubbles with Dielectric Constant 1.2-2.2 and Low Thermal Conductivity for High-Strength Composite Materials

Non-flammable Hollow Glass Bubbles with Diameter 30-105 Micrometers and Thermal Conductivity 0.04-0.06 W/m·K for Lightweight Composites

Glass Microballoons Hollow Glass Spheres with Temperature Resistance Up To 600°C Chemical Resistance and Spherical Shape

High Refractive Index Glass Microbubbles with Low Thermal Conductivity 0.2 W/m·K and Dielectric Constant 1.2-2.2 (100MHz) for Optical Applications

Hollow Glass Bubbles with 0.15 - 0.30 G/cm³ Bulk Density for Lightweight Composites Featuring Low Thermal Conductivity and Chemical Resistance

Glass Microballoons and Hollow Glass Spheres with 20-75 µm Diameter, Chemical Resistance, and 0.05 W/m·K Thermal Conductivity

HN40 Hollow Glass Microspheres for Thermal Insulation

Glass Microballoons Hollow Glass Spheres with Good Resistance To Most Chemicals, Thermal Conductivity 0.2, and 1-2 Microns Wall Thickness

High Temperature Resistance Glass Microbubbles with 16000 Psi Compressive Strength and Low Thermal Conductivity for Rubber Applications

Glass Microbubbles with 10-100 Microns Diameter and 0.2 Thermal Conductivity for Automobile Vehicle Manufacturing

16000 Psi Compressive Strength Glass Microbubbles with Superior Bonding Strength and Thermal Stability for Battery Pack Glue

High Durability Weight Reduction Glass Bubbles Microspheres with Particular Size 2-120μm