Hollow Glass Microspheres

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Hainuo HN15T hollow glass microspheres

HN15T lightweight filler microspheres

hollow glass microspheres low density

Packaging Details: 25 kg / bag (paper-plastic composite bag)；Optional packaging：25 kg paper-plastic composite bag (standard) / 10 kg small pack / 500 kg tonne bag / Custom packaging

Product Name: HN16K Glass Microspheres

Application: Oil Well Cementing ,Hollow Glass Bubble,HN16K,Composite Circuit Board,Chassis Coating

Product Name: HN60HS Glass Microspheres

Application: 5G,Low Density Drilling Fluid,Oil Well Cementing.

Product Name: HN60 Glass Microspheres

Application: Oil Field

Product Name: HN40 Glass Microspheres

Application: Construction

Density: 0.13–0.17 G/cm³

Strength: 600 Psi

Highlight:

Hollow Glass Microspheres 0.15 g/cm³

600 psi Compressive Strength Microspheres

40 μm Aerospace Hollow Glass Microspheres

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Ultra-Fine Hollow Glass Microspheres

High-Strength Glass Microspheres

Low-Density Hollow Glass Microspheres

Packaging Details: 25 kg / bag (paper-plastic composite bag)；Optional packaging：25 kg paper-plastic composite bag (standard) / 10 kg small pack / 500 kg tonne bag / Custom packaging

Product Name: HN18K Glass Microspheres

Application: Oil Well Cementing,Hollow Glass Bubble,HN18K,Composite Circuit Board,Low Density Drilling Fluid

Product Name: HN60S Glass Microspheres

Application: Lost Circulation Control / Reservoir Engineering

Product Name: HN60HS Glass Microspheres

Application: 5G,Low Density Drilling Fluid,Oil Well Cementing.

Product Name: HN60HS Glass Microspheres

Application: Composie Circuit Board,Oil Well Cementing,Low Density Drilling Fluid.

Product Name: HN60S Glass Microspheres

Application: Rubber,Ocean, Automobile Vehicle.

Product Name: HN18K Glass Microspheres

Application: Low Density Drilling Fluid,Hollow Glass Bubble,HN18K,Composite Circuit Board,Oil Well Cementing

Surface Area: High

Bulkdensity: 0.15 - 0.30 G/cm³

Temperatureresistance: Up To 600°C

Softening Tempera: 855℃