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N40 Hollow Glass Microspheres 10-75µm for Construction

Product Nam: N40 Glass Microspheres

Application: Construction

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HN40 Hollow Glass Microspheres for Construction 10-75 µm

Product Name: HN40 Glass Microspheres

Application: Construction

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HN25HS Hollow Glass Microspheres for Aerospace Adhesives 25-85µm

Product Name: HN25HS Glass Microspheres

Application: Construction,Rubber, Aerospace Adhesives,Boyancy Materials.

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HN20 Hollow Glass Microspheres for Thermal Insulation 30-105µm

Product Name: HN20 Glass Microspheres

Application: Construction

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HN20 Hollow Glass Microspheres for Construction 30-105µm

Product Name: HN20 Glass Microspheres

Application: Construction

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HN46HS Hollow Glass Microspheres for Automotive Plastic Parts

Product Name: HN46HS Glass Microspheres

Application: Automobile Vehicle

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HN40 Hollow Glass Microspheres 10-75µm for Construction

Product Name: HN40 Glass Microspheres

Application: Construction

Get Best Price

Video

HN20 Hollow Glass Microspheres for Thermal Insulation 30-105µm

Product Name: HN20 Glass Microspheres

Application: Construction

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HN25HS Hollow Glass Microspheres 25-85µm for Thermal Insulation

Product Name: HN25HS Glass Microspheres

Application: Construction,Rubber, Aerospace Adhesives,Boyancy Materials.

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HN40 Hollow Glass Bubbles 80 MPa Compressive Strength Lightweight Filler for Injection Molding Thermoplastic Composites

Material: Borosilicate Glass

Model: HN40

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Ultra-Low Density HN15 Hollow Glass Bubbles 0.08-0.15 g/cm³ Thermal Insulation Filler for Energy Efficient Coatings

Material: Borosilicate Glass

Model: HN15

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HN40 Hollow Glass Microspheres for Construction 10-75 µm

Product Name: HN40 Glass Microspheres

Application: Construction

Get Best Price

Video

HN20 Hollow Glass Microspheres for Thermal Insulation 30-105µm

Product Name: HN20 Glass Microspheres

Application: Construction

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HN60HS Hollow Glass Microspheres for 5G PCBs 10-55µm 14000 psi

Product Name: HN60HS Glass Microspheres

Application: 5G Technology

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HN38 Hollow Glass Microspheres for Aerospace Adhesives 20-75µm

Product Name: HN38 Glass Microspheres

Application: Aviation Materials

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HN60HS Hollow Glass Microspheres for Composite Circuit Boards

Product Name: HN60HS Glass Microspheres

Application: Composie Circuit Board,Oil Well Cementing,Low Density Drilling Fluid.

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Non-flammable Hollow Glass Bubbles with Diameter 30-105 Micrometers and Thermal Conductivity 0.04-0.06 W/m·K for Lightweight Composites

Hollow Glass Bubbles with Compressive Strength Up To 100 MPa, Low Thermal Conductivity 0.108 W/m·K, and Lightweight 0.15 - 0.30 g/cm³

Hollow Glass Bubbles with 0.15 - 0.30 G/cm³ Bulk Density and 1 - 2 Microns Wall Thickness for High Compressive Strength Up To 100 MPa

1 to 2 Microns Wall Thickness Hollow Glass Bubbles with True Density 0.44 to 0.48 and High Chemical Resistance for Industrial Use

N40 Hollow Glass Microspheres 10-75µm for Construction

HN40 Hollow Glass Microspheres for Construction 10-75 µm

HN25HS Hollow Glass Microspheres for Aerospace Adhesives 25-85µm

HN20 Hollow Glass Microspheres for Thermal Insulation 30-105µm

HN20 Hollow Glass Microspheres for Construction 30-105µm

HN46HS Hollow Glass Microspheres for Automotive Plastic Parts

HN40 Hollow Glass Microspheres 10-75µm for Construction

HN20 Hollow Glass Microspheres for Thermal Insulation 30-105µm

HN25HS Hollow Glass Microspheres 25-85µm for Thermal Insulation

HN40 Hollow Glass Bubbles 80 MPa Compressive Strength Lightweight Filler for Injection Molding Thermoplastic Composites

Ultra-Low Density HN15 Hollow Glass Bubbles 0.08-0.15 g/cm³ Thermal Insulation Filler for Energy Efficient Coatings

HN40 Hollow Glass Microspheres for Construction 10-75 µm

HN20 Hollow Glass Microspheres for Thermal Insulation 30-105µm

HN60HS Hollow Glass Microspheres for 5G PCBs 10-55µm 14000 psi

HN38 Hollow Glass Microspheres for Aerospace Adhesives 20-75µm

HN60HS Hollow Glass Microspheres for Composite Circuit Boards